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Rogers RT/duroid 5880 DK2.20 Df0.0009 (0.127-9.525mm) Copper Clad Laminate
Brief Introduction
RT/duroid 5880 is a glass microfiber reinforced PTFE composite designed for high-performance stripline and microstrip printed circuit board applications. With a dielectric constant of 2.20 and ultra-low dissipation factor, it provides exceptional electrical consistency and signal integrity, making it suitable for demanding RF and microwave systems up to Ku-band and beyond.
Technical Features & Benefits
Low and Stable Dielectric Constant: Dk = 2.20 ±0.02 at 10 GHz, with excellent uniformity across panels and frequency stability.
Ultra-Low Loss: Dissipation factor as low as 0.0009 at 10 GHz, supporting high-frequency, low-loss designs.
Excellent Thermal Stability: Thermal coefficient of εr = –125 ppm/°C, ensuring reliable performance across temperature ranges.
High Electrical Insulation: Volume resistivity ≥2×10⁷ MΩ·cm and surface resistivity ≥3×10⁷ MΩ.
Good Mechanical Properties: Balanced tensile and compressive modulus for reliable PCB fabrication and assembly.
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Typical Properties:
| Property |
Direction |
Units [3] |
Condition |
RT/duroid 5880 |
Test Method |
| Dielectric Constant, εr (Process) | Z | – | C24/23/50, 10 GHz | 2.20 ± 0.02 | IPC-TM-650 2.5.5.5 |
| Dielectric Constant, εr (Design) | Z | – | 8–40 GHz | 2.20 | Differential Phase Length Method |
| Dissipation Factor, tan δ | Z | – | C24/23/50, 10 GHz | 0.0009 | IPC-TM-650 2.5.5.5 |
| Thermal Coefficient of εr | Z | ppm/°C | –50°C to 150°C | –125 | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | Z | MΩ·cm | C96/35/90 | 2×10⁷ | ASTM D257 |
| Surface Resistivity | Z | MΩ | C96/35/90 | 3×10⁷ | ASTM D257 |
| Tensile Modulus (X) | X | MPa (kpsi) | 23°C | 1070 (156) | ASTM D638 |
| Tensile Modulus (Y) | Y | MPa (kpsi) | 23°C | 860 (125) | ASTM D638 |
| Compressive Modulus (Z) | Z | MPa (kpsi) | 23°C | 940 (136) | ASTM D695 |
| Moisture Absorption | N/A | % | D48/50, 0.062" | 0.02 | ASTM D570 |
| Thermal Conductivity | Z | W/(m·K) | 80°C | 0.20 | ASTM C518 |
| Coefficient of Thermal Expansion (X) | X | ppm/°C | 0–100°C | 31 | IPC-TM-650 2.4.41 |
| Coefficient of Thermal Expansion (Y) | Y | ppm/°C | 0–100°C | 48 | IPC-TM-650 2.4.41 |
| Coefficient of Thermal Expansion (Z) | Z | ppm/°C | 0–100°C | 237 | IPC-TM-650 2.4.41 |
| Density | N/A | g/cm³ | N/A | 2.2 | ASTM D792 |
| Copper Peel Strength | N/A | pli (N/mm) | 1 oz EDC after solder float | 31.2 (5.5) | IPC-TM-650 2.4.8 |
| Flammability | N/A | – | N/A | V-0 | UL94 |
| Lead-Free Process Compatible | N/A | – | N/A | Yes | N/A |
Application Areas
RF & Microwave Circuits: Stripline and microstrip designs for communication systems.
Ku-band and Above Applications: Satellite communications, radar systems.
Aerospace & Defense: Avionics, phased array antennas, electronic warfare.
Test & Measurement: High-frequency probes, calibration substrates.
Medical Electronics: High-frequency imaging and diagnostic equipment.
Available Configurations
Copper Cladding: Electrodeposited (½ oz to 2 oz), reverse-treated EDC, or rolled copper foil.
Panel Sizes: 18" × 12" (457 × 305 mm) and 18" × 24" (457 × 610 mm); other sizes available.
Thickness Range: From 0.005" (0.127 mm) to 0.375" (9.525 mm) with tight tolerances.
Special Claddings: Aluminum, copper, or brass plates for heat sinking and mechanical support.
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